I throw on a pair of vinyl gloves, squirt a dab on the heatsink (not the CPU), and spread an even layer with my finger. This has always been my rule of thumb whether it's metallic or non-metallic paste. You can see that the thermal compound is actually a poor heat conductor and that is exactly the reason why you only need a very thin layer of paste to fill the micro imperfections between the IHS and heatsink. > For example, the thermal conductivity of a high-grade thermal paste is 8.5 W/mK, and the heat conductivity of copper is 385 W/mK, or for aluminum 205 W/mK. Using too much the worst case is just that the CPU throttles and performance is sluggish and that rarely leads to an RMA.įor example, the thermal conductivity of a high-grade thermal paste is 8.5 W/mK, and the heat conductivity of copper is 385 W/mK, or for aluminum 205 W/mK. Yes, it is safer to put too much than too little. Thermal pastes are actually extremely bad at transferring heat and too much of it really has negative effects. The effect on thermals are absolutely not insignificant. There is virtually no effect on thermals.
#Smcfancontrol 205 degrees f Pc#
> since modern thermal pastes are non-conductive, there is no real downside to an enthusiastic application of paste except for making a mess, so you want to default to putting too much on rather than having some dumb intern kill a PC with an insufficient application. Putting LM on a laptop is a gimmick, and one with fairly considerable risk to the hardware, not something that is suitable for mass production.
It also can migrate over time, especially if you put a bit too much on, and is particularly unsuitable for laptops that are going to be moved around a lot. LM is conductive, so you need to be much more careful with the application, as over-application will kill the chip. In contrast, since modern thermal pastes are non-conductive, there is no real downside to an enthusiastic application of paste except for making a mess, so you want to default to putting too much on rather than having some dumb intern kill a PC with an insufficient application. This is different from modern desktop processors where there is an IHS to help spread the heat around - there is a very real danger to insufficient paste application on a bare die. If a bare-die CPU or GPU is not fully covered, the uncovered portions will rapidly become hot and the chip may die (especially if the thermal sensors are covered and cannot detect this).
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